Extreme Ultraviolet Lithography Market Opportunities 2023-2030
According to HTF Market Intelligence, the Global Extreme Ultraviolet Lithography market to witness a CAGR of 21.9% during forecast period of 2023-2028. The market is segmented by Extreme Ultraviolet Lithography Comprehensive Study by Type (Laser Produced Plasmas (LPP), Vacuum Sparks, Gas Discharges), Application (Memory, IDM (Integrated Device Manufacturer (IDM), Foundry, Others), Tool (Light Source, Mirrors, Mask, Others). The Extreme Ultraviolet Lithography market size is estimated to increase by USD 83099 Million at a CAGR of 21.9% from 2023 to 2028. The report includes historic market data from 2017 to 2022E. Currently, market value is pegged at USD 5879.6 Million.
Definition:
Extreme Ultraviolet Lithography (EUVL) is a technology used in the semiconductor industry to produce advanced microchips with higher resolution and smaller feature sizes. EUVL uses a wavelength of light in the extreme ultraviolet (EUV) range, which is about 13.5 nanometers in wavelength, to pattern and etch circuits onto a silicon wafer. The EUV light is generated by a laser that heats and vaporizes a small amount of tin, which then emits EUV light.
Market Trends:
Increasing Use of Extreme Ultraviolet Lithography in the Semiconductor Industry
Market Drivers:
Reduction in the Complexity and Cost
Increasing Trend of Miniaturization
Market Opportunities:
Advancements in Miniaturization and Sophistication of Electronic
Less Number of Masking Layers Compared To the Argon Fluoride Immersion Technology
The titled segments and sub-section of the market are illuminated below:
The Study Explore the Product Types of Extreme Ultraviolet Lithography Market: Laser Produced Plasmas (LPP), Vacuum Sparks, Gas Discharges
Key Applications/end-users of Extreme Ultraviolet Lithography Market: Memory, IDM (Integrated Device Manufacturer (IDM), Foundry, Others
Actual Numbers & In-Depth Analysis of Global Extreme Ultraviolet Lithography Market Size Estimation and Trends Available in Full Version of the Report.
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